DSM Pro Engineering's Process EDA is the next-generation AI-powered platform that transforms how semiconductor companies design, verify, and deliver cutting-edge ASICs. Reduce time-to-market while improving design quality and team collaboration.
Built for Every Stakeholder in the ASIC Design Flow
From individual engineers to C-level executives, Process provides tailored tools and insights that transform how semiconductor companies operate, collaborate, and deliver breakthrough innovations.
Oh we're not just an RTL-to-GDSII flow. We're a complete company flow, integrating every aspect of your design and business processes. This includes project ideation, financial modeling, design planning, a fully integrated RTL-to-GDSII tapeout, bug tracking, CRM, and more.
Revolutionary AI algorithms guides you along each of your steps, automating repetitive workflow tasks, optimizing PPA metrics, and predicting design issues before they occur. Reduce manual effort while achieving superior design quality on advanced process nodes.
All project information is now stored in an SQL database - not just the design, but project specs, financial models, the build flow, running tasks, individual tools, licenses, distributed machines, scripts, layouts, metrics, reports, customers, bug tracking, and more. The database is the glue that holds together your projects.
Process transforms ASIC design from a bottleneck to a competitive advantage. Our platform delivers specific capabilities that empower every stakeholder - from engineers pushing the boundaries of silicon to executives driving strategic decisions.
Measurable ROI from Day One
Process doesn't just improve your ASIC design workflow - it transforms your entire business. Our customers report dramatic improvements across all key performance indicators.
Powering Innovation Across Industries
AI & Machine Learning Chips
Design next-generation AI accelerators with optimized tensor processing units, neural network architectures, and power-efficient inference engines for edge computing and data centers.
5G/6G Communications
Accelerate development of advanced wireless baseband processors, RF transceivers, and mmWave beamforming ICs for next-generation telecommunications infrastructure.
Automotive & IoT
Create highly reliable automotive-grade processors for ADAS, autonomous driving, and connected vehicle applications.
High-Performance Computing
Design cutting-edge processors for data centers, supercomputers, and quantum computing interfaces with optimized memory hierarchies and interconnect architectures.
module processor_core (
input wire clk,
input wire rst_n,
input wire [31:0] inst_data,
output wire [31:0] data_addr,
output wire [31:0] data_out
);
// Advanced pipeline stages
reg [31:0] IF_ID_reg;
reg [31:0] ID_EX_reg;
reg [31:0] EX_MEM_reg;
// AI-optimized datapath
always @(posedge clk) begin
// Process optimization logic
end
endmodule
Join leading semiconductor companies in revolutionizing their design workflows with DSM Pro Engineering's Process platform. Whether you're a startup pushing the boundaries of innovation or an enterprise scaling your operations, we have the perfect solution for you.
Start with a demo and see the benefits for yourself
Get personalized onboarding from our ASIC design experts
See ROI within your first project
